Analysis of Signal Integrity of High-Speed Interconnects on Meshed Ground Plane

Analysis of Signal Integrity of High-Speed Interconnects on Meshed Ground Plane

ZHANG Hua, HONG Wei

ACTA ELECTRONICA SINICA ›› 2006, Vol. 34 ›› Issue (12) : 2218-2220.

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PDF(498 KB)

ACTA ELECTRONICA SINICA ›› 2006, Vol. 34 ›› Issue (12) : 2218-2220.

Analysis of Signal Integrity of High-Speed Interconnects on Meshed Ground Plane

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2006, 34(12): 2218-2220.

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