Researches of Lead-Free Solder Joint Reliability Under Board-Level Drop Impact

Researches of Lead-Free Solder Joint Reliability Under Board-Level Drop Impact

LIU Fang, MENG Guang, ZHAO Mei, ZHAO Jun-feng

ACTA ELECTRONICA SINICA ›› 2007, Vol. 35 ›› Issue (11) : 2083-2086.

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PDF(736 KB)

ACTA ELECTRONICA SINICA ›› 2007, Vol. 35 ›› Issue (11) : 2083-2086.

Researches of Lead-Free Solder Joint Reliability Under Board-Level Drop Impact

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2007, 35(11): 2083-2086.

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