Optimal Design for Improving Thermo-Mechanical Fatigue Reliability of Solder Joint of PBGA Component based on Robust Design

ZHOU Ji-cheng, XIAO Xiao-qing, EN Yun-fei, HE Xiao-qi

ACTA ELECTRONICA SINICA ›› 2007, Vol. 35 ›› Issue (11) : 2180-2183.

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ACTA ELECTRONICA SINICA ›› 2007, Vol. 35 ›› Issue (11) : 2180-2183.

Optimal Design for Improving Thermo-Mechanical Fatigue Reliability of Solder Joint of PBGA Component based on Robust Design

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2007, 35(11): 2180-2183.

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