Multiple Modal Vibration and FEM Analysis of Ultrasonic Transducer for Thermsonic Flip Chip Bonding

Multiple Modal Vibration and FEM Analysis of Ultrasonic Transducer for Thermsonic Flip Chip Bonding

LONG Zhi-li, WU Yun-xin, HAN Lei, ZHONG Jue

Acta Electronica Sinica ›› 2008, Vol. 36 ›› Issue (2) : 255-260.

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PDF(838 KB)

Acta Electronica Sinica ›› 2008, Vol. 36 ›› Issue (2) : 255-260.

Multiple Modal Vibration and FEM Analysis of Ultrasonic Transducer for Thermsonic Flip Chip Bonding

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 36(2): 255-260

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