Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device

Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device

SONG Jing;HUANG Qing-an;TANG Jie-ying

ACTA ELECTRONICA SINICA ›› 2008, Vol. 36 ›› Issue (5) : 943-947.

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PDF(495 KB)

ACTA ELECTRONICA SINICA ›› 2008, Vol. 36 ›› Issue (5) : 943-947.

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Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 36(5): 943-947.

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