Electromigration in Micro-Interconnections of Electronic Packaging

Electromigration in Micro-Interconnections of Electronic Packaging

YIN Li-meng;ZHANG Xin-ping

ACTA ELECTRONICA SINICA ›› 2008, Vol. 36 ›› Issue (8) : 1610-1614.

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PDF(208 KB)

ACTA ELECTRONICA SINICA ›› 2008, Vol. 36 ›› Issue (8) : 1610-1614.

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Electromigration in Micro-Interconnections of Electronic Packaging

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2008, 36(8): 1610-1614.

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