Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model

LIANG Ying;HUANG Chun-yue;YAN De-jin;LI Tian-ming

ACTA ELECTRONICA SINICA ›› 2009, Vol. 37 ›› Issue (11) : 2520-2524.

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ACTA ELECTRONICA SINICA ›› 2009, Vol. 37 ›› Issue (11) : 2520-2524.
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Study on Thermal Placement Optimization of Stacked 3D-MCM Based on Thermal Superposition Model

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 37(11): 2520-2524.

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