Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections

Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections

YIN Li-meng;ZHANG Xin-ping

ACTA ELECTRONICA SINICA ›› 2009, Vol. 37 ›› Issue (2) : 253-257.

PDF(772 KB)

PDF(772 KB)

ACTA ELECTRONICA SINICA ›› 2009, Vol. 37 ›› Issue (2) : 253-257.

论文

Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections

{{article.zuoZhe_EN}}

Author information +

History +

HeighLight

{{article.keyPoints_en}}

Abstract

{{article.zhaiyao_en}}

Key words

QR code of this article

Cite this article

Download Citations

{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 37(2): 253-257.

References

Publishing order | Descend order by publishing year | Descend order by cited within

References

{{article.reference}}

Funding

RIGHTS & PERMISSIONS

{{article.copyrightStatement_en}}

{{article.copyrightLicense_en}}

PDF(772 KB)

Accesses

Citation

Detail

Sections

Recommended

/

〈

〉