Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections
YIN Li-meng;ZHANG Xin-ping
Acta Electronica Sinica ›› 2009, Vol. 37 ›› Issue (2) : 253-257.
Electromigration Induced Brittle Creep Fracture Behavior of Lead-Free Solder Micro-Interconnections
{{custom_ref.label}} |
{{custom_citation.content}}
{{custom_citation.annotation}}
|
/
〈 | 〉 |