Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate

Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate

XU Gao-wei;LUO Le;GENG Fei;HUANG Qiu-ping;ZHOU Jian

ACTA ELECTRONICA SINICA ›› 2009, Vol. 37 ›› Issue (5) : 1006-1012.

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ACTA ELECTRONICA SINICA ›› 2009, Vol. 37 ›› Issue (5) : 1006-1012.

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Warpage of Three-Dimensional Multi-Chip Module Based on Embedded Substrate

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2009, 37(5): 1006-1012.

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