Study on the Void Formation in Through-Mask Plated Redistribution Layer in Wafer Level Package

NING Wen-guo, ZHU Chun-sheng, LI Heng, XU Gao-wei, LUO Le

ACTA ELECTRONICA SINICA ›› 2014, Vol. 42 ›› Issue (2) : 411-416.

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ACTA ELECTRONICA SINICA ›› 2014, Vol. 42 ›› Issue (2) : 411-416.

Study on the Void Formation in Through-Mask Plated Redistribution Layer in Wafer Level Package

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{{article.zuoZheEn_L}}. {{article.title_en}}[J]. {{journal.qiKanMingCheng_EN}}, 2014, 42(2): 411-416.

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