Research on Semi-Analytical Thermal Analysis of Multilayer Cylindrical Electronic Module

SHI Peng; CHEN Ya-ni; WANG Zhan-min

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Research on Semi-Analytical Thermal Analysis of Multilayer Cylindrical Electronic Module

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- Research on Semi-Analytical Thermal Analysis of Multilayer Cylindrical Electronic Module
- Acta Electronica Sinica Vol. 29, Issue 8, Pages: 1121-1122(2001)
- 作者机构：
  
  1. 西安建筑科技大学理学院,陕西,西安,710055
  2. 西安微电子技术研究所,陕西,西安,710054
  3. 西安建筑科技大学理学院陕西西安,710055
  4. 西安微电子技术研究所陕西西安,710054
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN60TK11
- Published：2001
- 稿件说明：
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SHI Peng, CHEN Ya-ni, WANG Zhan-min. Research on Semi-Analytical Thermal Analysis of Multilayer Cylindrical Electronic Module[J]. Acta Electronica Sinica, 2001, 29(8): 1121-1122.
DOI：

SHI Peng, CHEN Ya-ni, WANG Zhan-min. Research on Semi-Analytical Thermal Analysis of Multilayer Cylindrical Electronic Module[J]. Acta Electronica Sinica, 2001, 29(8): 1121-1122. DOI：

摘要

本文研究上表面含热源的多层圆形组件半解析的热分析计算方法

用计算机求解其数值解来计算组件上表面温度分布.该计算方法可以用于集成电路、混合电路和微组装件的热设计工作.

Abstract

Semi-analytical thermal analysis method of multilayer cylindrical electronic module with heat sources in the surface of the module is presented in this paper.The numerical solution of the temperature distribution in the surface of the modules is calculated by computer using this method.This method can be applied to thermal design of integrated circuits

hybrid circuits

or electronic module.

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