Low Temperature Co-fired Ceramics(LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules(MMCM).A three dimensional(3D) LTCC microwave transmission structure was studied in this paper

and stacked vias were applied in the structure to realize vertical microwave interconnecting.The 3D LTCC structure and the way of vertical interconnecting were simulated and optimized by the electromagnetic field analysis software.Good agreement was acquired between the simulated results and the experimental results.The testing of monolithic microwave integrated circuit(MMIC) chips and the bonding interconnecting technique for MMCM were described

and an application example of X-band MMCM was introduced.