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Thermal Analysis of the Ring-Plane TWT in the Interaction Area
更新时间:2025-07-16
    • Thermal Analysis of the Ring-Plane TWT in the Interaction Area

    • Acta Electronica Sinica   Vol. 30, Issue 12, Pages: 1848-1852(2002)
    • CLC: TN124
    • Published:2002

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  • GONG Yu-bin, QIN Zhi-dong, WANG Wen-xiang, et al. Thermal Analysis of the Ring-Plane TWT in the Interaction Area[J]. Acta Electronica Sinica, 2002, 30(12): 1848-1852. DOI:

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