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Analysis of Heat Transfer Performance about Microchannel Heat Sinks for Electronic Equipment Cooling
更新时间:2025-07-16
    • Analysis of Heat Transfer Performance about Microchannel Heat Sinks for Electronic Equipment Cooling

    • Acta Electronica Sinica   Vol. 31, Issue 5, Pages: 737-741(2003)
    • CLC: TH297
    • Published:2003

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  • DONG Tao, HOU Li-ya, ZHU Li, et al. Analysis of Heat Transfer Performance about Microchannel Heat Sinks for Electronic Equipment Cooling[J]. Acta Electronica Sinica, 2003, 31(5): 737-741. DOI:

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