Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design

HUANG Chun-yue; ZHOU De-jian; WU Zhao-hua

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Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design

更新时间：2025-07-16

- Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design
- Acta Electronica Sinica Vol. 33, Issue 5, Pages: 788-792(2005)
- 作者机构：
  
  1. 西安电子科技大学机电工程学院,陕西,西安,710071
  2. 桂林电子工业学院机电与交通工程系,广西,桂林,541004
  3. 西安电子科技大学机电工程学院陕西西安,710071
  4. 桂林电子工业学院机电与交通工程系广西桂林,541004
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN406TG404
- Published：2005
- 稿件说明：
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HUANG Chun-yue, ZHOU De-jian, WU Zhao-hua. Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design[J]. Acta Electronica Sinica, 2005, 33(5): 788-792.
DOI：

HUANG Chun-yue, ZHOU De-jian, WU Zhao-hua. Study on the Relationships between Solder Joint Process Parameters and Reliability of Plastic Ball Grid Array Component Based on the Orthogonal Experiment Design[J]. Acta Electronica Sinica, 2005, 33(5): 788-792. DOI：

摘要

基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究.采用混合水平正交表

(2×3

)设计了18种不同工艺参数组合的PBGA测试样件

进行了546小时、最大循环周数2140周的PBGA测试样件可靠性加速热循环试验.基于试验结果进行了极差分析和方差分析;研究了PBGA测试样件寿命的威布尔分布;采用有限元分析方法对热循环加载条件下PBGA焊点内应力应变分布进行了研究.试验结果表明失效焊点裂纹出现于焊点与芯片基板的交界面上.研究结果表明:样件规格对PBGA焊点可靠性有高度显著影响

芯片配重对PBGA焊点可靠性有显著的影响

焊盘直径和钢网厚度对PBGA焊点可靠性无显著影响;最优工艺参数组合为:S2D2G2M1和S2D2G2M2.有限元分析表明在热循环加载条件下PBGA器件内应力最大区域位于焊点与芯片基板的接触面上

裂纹首先在焊点与芯片基板的接触面处产生

有限元分析结果与试验结果相吻合.

Abstract

The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.By using a

(2×3

) mixed-level orthogonal array

the PBGA test vehicles which have 18 different process parameters' combinations were designed firstly

and then the accelerated thermal cycling test of PBGA test vehicles

which lasted 546 hours with 2140 cycles

was carried out subsequently.Based on the test results

the range analysis and the varianc

e analysis were performed

the failure distribution of PBGA test vehicles was also characterized by using two-parameter Weibull distribution

finally

the stress and strain distribution within the PBGA solder joint under thermal cycles were studied by finite element analysis.The thermal cycling test results show that the cracks of failure solder joints occur at the interface between the solder joints and the bismaleimide-triazine(BT)substrate.The results of study show that specification size of PBGA component has a significant effect on the reliability of solder joints

the chip weight has a certain effect on the reliability

whereas the diameter of pad and the thickness of stencil have little effect on the reliability.The best combinations of process parameters are S2D2G2M1 and S2D2G2M2.The finite element analysis indicates that the maximum stresses of PBGA component under thermal cycles occur at the interface between the solder joint and the BT substrate.The solder joint cracks should be initiated at the interface and then propagate laterally through solder joint.The finite element analysis results are in good accord with the experimental results.Some results of this work have been applied in practice to assemble the PBGA component.

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