Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates

GUO Chun-sheng; LI Zhi-guo

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Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates

更新时间：2025-07-16

- Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates
- Acta Electronica Sinica Vol. 33, Issue 8, Pages: 1519-1522(2005)
- 作者机构：
  
  北京工业大学电子信息与控制工程学院,北京,100022
- 作者简介：
- 基金信息：
- DOI：
  CLC： TM215.3
- Published：2005
- 稿件说明：
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GUO Chun-sheng, LI Zhi-guo. Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates[J]. Acta Electronica Sinica, 2005, 33(8): 1519-1522.
DOI：

GUO Chun-sheng, LI Zhi-guo. Study on Reliability of Multi-Layer Interconnection and Thick-Film Resistors in MCM-C Substrates[J]. Acta Electronica Sinica, 2005, 33(8): 1519-1522. DOI：

摘要

重点研究了MCM-C基板中多层互连和厚膜电阻的可靠性.试验采用温度应力和电应力的双应力加速寿命试验.试验发现

温度小于180℃时互连失效在MCM-C基板失效中占主要地位

膜电阻失效相对互连失效可忽略不计.在温度高于180℃时膜电阻失效将起较大作用

即膜电阻比互连温度加速系数要大.重点计算了膜电阻和互连寿命分布及加速系数.

Abstract

The paper mainly studies the reliability of multi-layer intercnonections

vias and thick-film resistors in Multi-chip Module-Ceramic(MCM-C) substrates.Temperature stress and voltage stress are used to accelerate the life test.The results show that when the temperature is under 180℃

the failure of metal lines plays a much more important role than the failure of film resistors;but when it's over 180℃

the failure of film resistors will also be important.The paper also calculated the lifetime and accelerating coefficient of metal lines and thick-film resistors.

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Li Zhengfan

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Depart. of Electronic Engineer, Shanghai Jiao-Tong University

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