Low temperature co-fired ceramics (LTCC) technology and three dimensional (3D) microwave cubic packaging technology for microwave modules are effective methods for realizing microwave modules miniature and light with high performance and high reliability.In this paper

3D integrated microwave modules based on LTCC are studied and developed.The cubic interconnecting structure of 3D integrated microwave modules

the vertical microwave interconnecting of 3D integrated LTCC microwave circuit substrates

and the vertical microwave interconnecting of microwave multi-chip module (MMCM) are described in detail.The volume and weight of 3D integrated microwave modules with these technologies are reduced by 40% and 38% respectively compared to traditional 2D LTCC integrated microwave modules

and the electric performances are about the same.