A test structure to measure the diffusivity of polysilicon thin films is proposed.The radiant heat loss and the convective heat loss from the structure have been considered.The same heating constant current is applied in the two beams
with the same width and thickness but variant length.The change of resistance with time up to thermal steady state is measured using a separation circuit
and then thermal diffusivity can be obtained.The model has been verified by ANSYS.The experiments show a thermal diffusivity of 1.059×10