Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device

SONG Jing; HUANG Qing-an; TANG Jie-ying

您当前的位置：

首页 >

文章列表页 >

Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device

更新时间：2025-07-16

- Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device
- Acta Electronica Sinica Vol. 36, Issue 5, Pages: 943-947(2008)
- 作者机构：
  
  东南大学MEMS教育部重点实验室,江苏,南京,210096
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN402TN405
- Published：2008
- 稿件说明：
移动端阅览
SONG Jing, HUANG Qing-an, TANG Jie-ying. Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device[J]. Acta Electronica Sinica, 2008, 36(5): 943-947.
DOI：

SONG Jing, HUANG Qing-an, TANG Jie-ying. Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device[J]. Acta Electronica Sinica, 2008, 36(5): 943-947. DOI：

摘要

大量试验和数值仿真结果均已确认封装-器件的热失配对MEMS器件性能及可靠性有显著影响

即热致封装效应.然而迄今为止仍缺乏有效的物理模型对此加以系统描述.本文基于单元库法思想和节点法分析手段构建了MEMS热致封装效应的理论模型.通过对非器件结构如锚区、衬底等标准化单元建模

扩充了节点分析法在封装级MEMS仿真领域的应用.文中以常见MEMS基本器件和封装结构为例进行了研究

计算了热致封装效应对器件谐振特性的影响

并利用有限元仿真进行验证.最后讨论了封装级MEMS设计面临的挑战.

Abstract

With the advance of the modeling of the device-level behaviors for the MEMS systems

characterizations for the package-level behaviors are becoming important.Results from either experimental or numerical studies have already validated the thermally-induced package effects on the performance and reliability of MEMS systems

while the theoretical descriptions for these effects are still lacked.In this paper

a theoretical joint model for the whole packaged MEMS system is established based on the Cell Library Concept and the Nodal Analysis Method to enable the package-level simulations for the designed devices.Cases of conventional package-device systems are studied to demonstrate the application of this joint model

and the results agree well with the FEM calculations.The challenges for the design of package-level MEMS systems are finally discussed.

关键词

Keywords

references

Views

860

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Characteristic Analysis of ZCS Resonant Switched Capacitor DC-DC Converters

Parallel Resonant DC Link Inverter with a Single Storage Capacitor-Assisted Commutation

Resonant DC Link Inverter with a Single Auxiliary Switch

Parallel Resonant DC Link Inverter with Low-Loss Auxiliary Circuit

Active Clamped Resonant DC-Link Inverter with Clamped Diode Under Low Voltage

Related Author

ZHANG Bo

ZHENG Chun-fang

QIU Dong-yuan

LIU Xiao-qin

WANG Tian-shi

CHEN Xiang-xue

LIU Yan-song

WANG Qiang

Related Institution

College of Electric Engineering,South China University of Technology

College of Information and Control Engineering, Liaoning Shihua University

School of Information and Control Engineering, Liaoning Shihua University

Key Laboratory of New Energy Generation and Power Conversion, Nanjing University of Aeronautics and Astronautics

School of Information and Control Engineering Liaoning Shihua University Fushun Liaoning China

⁰