Phase Portraits and Equivalent Model for Wire Bonding Dynamics

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Phase Portraits and Equivalent Model for Wire Bonding Dynamics

更新时间：2025-07-08

- Phase Portraits and Equivalent Model for Wire Bonding Dynamics
- Acta Electronica Sinica Vol. 38, Issue 11, Pages: 2697-2703(2010)
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  CLC： TG156
- Published：2010
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Phase Portraits and Equivalent Model for Wire Bonding Dynamics[J]. Acta Electronica Sinica, 2010, 38(11): 2697-2703.
DOI：

Phase Portraits and Equivalent Model for Wire Bonding Dynamics[J]. Acta Electronica Sinica, 2010, 38(11): 2697-2703. DOI：

摘要

使用常规、微观电镜、动力相图和统计时频分析等方法

进行了引线键合机理的实验研究.通过对换能系统和劈刀振速的高频分量、键合压力的测试

以及键合界面微观结构的观察

建立了键合区域宏观受载等效模型

和对键合机理的框架认识.可作为键合过程优化的指导

和键合动力学建模的依据.

Abstract

Wire bonding experiments were performed in a lab test-bed.Vibration behavior of bonder transducer and bonding pressure were monitored by Laser Doppler Vibrometer.For assessing wire bond quality

the bond lift-off microstructures were observed by scanning electron microscope as a post-effect evaluating for bonding process.Wavelet decomposing

combined with statistics-based data processing

was utilized to explore the details of bonding process.A macroscopical equivalent model for bonding area is developed based on the velocity vs.pressure phase portraits.The basic understanding on wire bonding can be used for identifying wire bonding dynamics and optimizing the machine set-ups.

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Related Institution

Advanced Interdisciplinary Technology Research Center, National Innovation Institute of Defense Technology, Academy of Military Science

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Advanced Interdisciplinary Technology Research Center， National Innovation Institute of Defense Technology

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