The Analysis and ANSYS Simulation for the Thermal Condition of Pulse Helix TWT

ZHAO Xing-qun; ZHANG Guo-xing; SUN Xiao-han

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The Analysis and ANSYS Simulation for the Thermal Condition of Pulse Helix TWT

更新时间：2025-07-16

- The Analysis and ANSYS Simulation for the Thermal Condition of Pulse Helix TWT
- Acta Electronica Sinica Vol. 32, Issue 6, Pages: 1029-1032(2004)
- 作者机构：
  
  东南大学电子工程系,江苏,南京,210096
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN124
- Published Online：25 June 2004，
  
  Published：2004
- 稿件说明：
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ZHAO Xing-qun, ZHANG Guo-xing, SUN Xiao-han. The Analysis and ANSYS Simulation for the Thermal Condition of Pulse Helix TWT[J]. Acta Electronica Sinica, 2004, 32(6): 1029-1032.
DOI：

ZHAO Xing-qun, ZHANG Guo-xing, SUN Xiao-han. The Analysis and ANSYS Simulation for the Thermal Condition of Pulse Helix TWT[J]. Acta Electronica Sinica, 2004, 32(6): 1029-1032. DOI：

摘要

本文对国外上世纪90年代的产品

高输出功率高工作比的脉冲行波管进行热状态的分析

通过计算全面了解国外行波管的热设计要求及必要的工艺措施

为国内同类型行波管提高可靠性服务.文中对国内同类型产品的表面热阻率进行测量

从初步分析结果指出减小表面热阻率的方向和措施.使用ANSYS软件实际模拟仿真螺线行波管

得到更为准确、可靠的结果

并和设计计算基本保持一致.

Abstract

The analysis and simulation for the thermal condition of pulse helix TWT against a foreign product are given. Through its process

the requirements for the thermal design could be understood quite well and the necessary technology measurement could be taken by the manufacturing engineers.It also leads to improve the reliability for the same kind of TWT.The surface thermal resistivity is measured

and the primary analysis shows how to reduce the surface thermalresistivity by various methods.With the help of ANSYS

the thermal condition ofpulse helix TWT has been simulated

its results consistent with the design calculation in the main area are more accurate and reliable.

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