Based on the defect size distributions on the silicon wafer
the fractal feature of the point defect distribution is analysed and the fractal model of describing the defect size distribu-nons is obtained by means of the system of the fractional dimension. This model has physical meaning clearly. A new dynamical model of expressing the change of defect size is given and discussed. The model can obtain defect characteristics which are necessary for accurate functional yield prediction during design for manufacturability of IC’s.