Analysis of Propagation Characteristics of High-T<sub>c</sub> Superconduction Interconnects for VLSI Packing

康晋锋; 韩汝畸; 王阳元

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Analysis of Propagation Characteristics of High-T_c Superconduction Interconnects for VLSI Packing

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- Analysis of Propagation Characteristics of High-T_c Superconduction Interconnects for VLSI Packing
- Acta Electronica Sinica Issue 11, (1996)
- 作者机构：
  
  北京大学微电子所
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN101
- Published：1996
- 稿件说明：
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[1]康晋锋,韩汝畸,王阳元.高T_c超导互连线高频传输特性分析[J].电子学报,1996(11):105-107+95.

康晋锋, 韩汝畸, 王阳元. Analysis of Propagation Characteristics of High-T_c Superconduction Interconnects for VLSI Packing[J]. Acta Electronica Sinica, 1996, (11).
[1]康晋锋,韩汝畸,王阳元.高T_c超导互连线高频传输特性分析[J].电子学报,1996(11):105-107+95. DOI：

康晋锋, 韩汝畸, 王阳元. Analysis of Propagation Characteristics of High-T_c Superconduction Interconnects for VLSI Packing[J]. Acta Electronica Sinica, 1996, (11). DOI：

摘要

利用能较好描述高温超导体反常温度特征的推广二流体模型和传输线理论，计算和模拟了用于ＶＬＳＩ封装互连的高温超导互连线的传输常数随温度的变化关系和上升时间对温度及互连线宽度与长度的依赖关系，并将之与利用传统二流体模型计算和模拟的结果相比较，指出了传统二流体模型对高温超导互连线传输性质描述的局限性。我们的模型可用于高温超导ＶＬＳＩ互连的系统ＣＡＤ中。

Abstract

The propagation constant and rise time of High-Tc superconducting interconnect for VLSI packaging are calculated and simulated by using a generalized two-fluid model and transmission line theory.Meanwhile

the temperature dependences of attenuation constant and phase velocity as well as the rise time based on the generalized two-fluid model are compared with those based on conventional two-fluid model.The limitation of the later is indicated.Our results could be used in the VLSI system CAD.

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YU Hai-rong

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Institute of Microelectronics,Tsinghua University

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Analysis of Propagation Characteristics of High-Tc Superconduction Interconnects for VLSI Packing

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Analysis of Propagation Characteristics of High-T_c Superconduction Interconnects for VLSI Packing