This paper describes the experimental equipment and technical process of laser-recrystallization for three dimensional integrated circuit(3D-IC)
reports the experimental results of local recrystallization by laser single scanning on samples with reflective-stripe structure
and makes some discussion about these results.The experimental results indicate that the quality of recrystallization is related to laser power.preheating temperature
width of stripes with high reflectivity and scanning velocity of laser.Also
the stability of technique affects the quality.With technology of local recrystallization by single laser scanning
long single-crystal SOI(silicon-on-insulator) stripes which can be used to make high-quality MOSFET have been obtained.