Engineering and Design Techniques for Manufacturability of Integrated Circuits:An Overview

郝跃; 焦永昌

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Engineering and Design Techniques for Manufacturability of Integrated Circuits:An Overview

更新时间：2025-12-08

- Engineering and Design Techniques for Manufacturability of Integrated Circuits:An Overview
- Acta Electronica Sinica Issue 10, (1995)
- 作者机构：
  
  西安电子科技大学微电子研究所
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN402
- Published：1995
- 稿件说明：
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[1]郝跃,焦永昌.集成电路可制造性工程与设计方法学[J].电子学报,1995(10):86-93.

郝跃, 焦永昌. Engineering and Design Techniques for Manufacturability of Integrated Circuits:An Overview[J]. Acta Electronica Sinica, 1995, (10).
[1]郝跃,焦永昌.集成电路可制造性工程与设计方法学[J].电子学报,1995(10):86-93. DOI：

郝跃, 焦永昌. Engineering and Design Techniques for Manufacturability of Integrated Circuits:An Overview[J]. Acta Electronica Sinica, 1995, (10). DOI：

摘要

集成电路（ＩＣ）可制造性工程与设计是近年来发展很快的研究领域，它集ＩＣ设计、制造、封装和测试过程为一体，在统一框架（即产品制造成本和成品率驱动）下，对产品进行规划和设计。应用该技术可以大大缩短ＩＣ产品研制周期、降低制造成本、提高成品率和可靠性，本文将综述该领域的研究进展，并阐述进一步的研究方向。

Abstract

Recently

there has been a growing research field on engineering and design for manUfacturability of integrated circuits. It is an integration of design

fabrication

assembly and test engineering group into the process of manufacturing an IC. Under the unitized framework of driven manufacturing cost and yield

IC product will be designed and programed. So

the technique can shorten the period of research and development

reduce the manufacturing cost

increase yield and reliability of IC products. This paper describes the research progress in IC manufacturability field and gives the direction tion of further study.

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