您当前的位置:
首页 >
文章列表页 >
Resistance Computation for Multilayer Packaging Structures
更新时间:2025-12-08
    • Resistance Computation for Multilayer Packaging Structures

    • Acta Electronica Sinica   Issue 5, (1995)
    • CLC: TN305.94
    • Published:1995

    移动端阅览

  • 任怀龙, 吴洪江, 李松法. Resistance Computation for Multilayer Packaging Structures[J]. Acta Electronica Sinica, 1995, (5). DOI:

  •  
  •  
icon
试读结束,您可以激活您的VIP账号继续阅读。
去激活 >
icon
试读结束,您可以通过登录账户,到个人中心,购买VIP会员阅读全文。
已是VIP会员?
去登录 >

0

Views

34

下载量

2

CSCD

Alert me when the article has been cited
提交
Tools
Download
Export Citation
Share
Add to favorites
Add to my album

Related Articles

Electromagnetic Modeling of Conductor Object Composed of Arbitrary Shaped Line,Surface and Volume
Investigation on Transverse Radiation Phenomenon of NRD Guide Slot Antenna
A Numerical Scheme to Analyze 2D EM Scattering by a Dielectric Cylinder Under Oblique-Incidence
The EM Analysis of an Open-Ended Coaxial Line Used in Nondestructive Measurement
Application of a Matrix Perturbation Theory to the Computation of Internal Fields Inside a Three-Dimensional Lossy Biological Body

Related Author

MAO Jun-jie
CHAI Shun-lian
DONG Jian
XU Shan-jia
ZENG Xiang-yin
ZHOU Hou-xing
HONG Wei
XU Feng

Related Institution

School of Electronic Science and Engineering,National Univ.of Defense Technology
University of Science and Technology of China
State Key Laboratory of Millimeter Waves, Southeast University
Institute of Electronics, Academia Sinica
Xidian University
0