The Reliability Analysis and Thermal Fatigue Dislocation Substructure Evolution of 62Sn-36Pb-2Ag Solder Joints

李云卿; 唐祥云; 马莒生

您当前的位置：

首页 >

文章列表页 >

The Reliability Analysis and Thermal Fatigue Dislocation Substructure Evolution of 62Sn-36Pb-2Ag Solder Joints

更新时间：2025-12-08

- The Reliability Analysis and Thermal Fatigue Dislocation Substructure Evolution of 62Sn-36Pb-2Ag Solder Joints
- Acta Electronica Sinica Issue 11, (1994)
- 作者机构：
  
  清华大学材料科学与工程系
- 作者简介：
- 基金信息：
- DOI：
  CLC： TN420.6
- Published：1994
- 稿件说明：
移动端阅览
[1]李云卿,唐祥云,马莒生.62Sn－36Pb－2Ag焊点的可靠性及热疲劳位错亚结构的演化分析[J].电子学报,1994(11):32-36.

李云卿, 唐祥云, 马莒生. The Reliability Analysis and Thermal Fatigue Dislocation Substructure Evolution of 62Sn-36Pb-2Ag Solder Joints[J]. Acta Electronica Sinica, 1994, (11).
[1]李云卿,唐祥云,马莒生.62Sn－36Pb－2Ag焊点的可靠性及热疲劳位错亚结构的演化分析[J].电子学报,1994(11):32-36. DOI：

李云卿, 唐祥云, 马莒生. The Reliability Analysis and Thermal Fatigue Dislocation Substructure Evolution of 62Sn-36Pb-2Ag Solder Joints[J]. Acta Electronica Sinica, 1994, (11). DOI：

摘要

采用热疲劳试验分析了表面封装焊点的可靠性。讨论了不同的元器件及基片镀层工艺对焊点可靠性的影响，初步探讨了热疲劳过程中位错亚结构的变化及焊点的失效机理。结果表明：金属间化合物对焊点失效有重要影响．镀Ａｕ焊点热疲劳裂纹萌生于ＡｕＳｎ４金属间化合物并在其中扩展，镀Ｎｉ／Ａｕ焊点热疲劳过程中位错在ＡｕＳｎ４粒子处塞积，引起ＡｕＳｎ４／β－Ｓｎ界面应力集中，导致热疲劳裂纹沿ＡｕＳｎ４／β－Ｓｎ界面萌生，萌生后的裂纹在β－Ｓｎ相中扩展，ＴＥＭ观察也证明β－Ｓｎ相中位错密度较高。

Abstract

The reliabilrty of 62Sn-36Pb-2Ag surface mount solder joints has been analyzed by means of thermal fatigue tests.Meanwhile

the effect of different plated process for components and substrate on reliability is discussed

and the evolution of thermal fatigue dislocation substrucure and failure mechanism of solder joints have been studied tentatively. The results show that:intermetallic compounds influence the reliability of solder joints significantly

for solder joints of components and substrate plated with Au

the thermal fatigue cracks initate and propagate in AuSn4 intermetallic compounds ;on the other hand

solder joints plated with Ni/Au

cracks initiate at the AuSn4/β-Sn interface. TEM observation finds out that there is high density dislocation in β-Sn phase after crack initiation.

关键词

Keywords

references

Views

146

下载量

CSCD

Alert me when the article has been cited

提交

Tools

Publicity Resources

Dual-Layer Federated Learning Based Edge Collaborative Computing Mechanism for High Dynamic Internet of Vehicle Businesses

Highly Reliable Gate Driver on Array Circuit Using Time-Division Driving Method Base on IGZO Thin Film Transistor

Study of Highly Reliable Gate Driver on Array Based on InGaZnO Thin Film Transistor

Y/R Model of Integrated Circuits Based on the Open Circuit Fault of Interconnections

IPool-ADELIN Protocol for Reliable Transport in Underwater Acoustic Sensor Networks

Related Author

XU Si-ya

GUO Jia-hui

ZHOU Liu-fei

SHAO Xian-jie

WANG Hai-hong

WANG Bao-ping

CHEN Xu

WANG Bao-ping

Related Institution

State Key Laboratory of Networking and Switching Technology, Beijing University of Posts and Telecommunications

Research and Development Department， Nanjing BOE Display Technology Co.， Ltd.

School of Electronic Science and Engineering， Southeast University

Department of mathematics of Baoji college of Arts and scienceBaojiShaanxi 721007China

Microelectronics Institute of Xidian University Xi'anShaanxi 710071China

⁰