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1. 中国科学院上海冶金所
2. 上海无线电十四厂
Published:1986
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[1]沈宗雍,林成鲁,邹世昌,薛自.Ar~+激光再结晶多晶硅薄膜制备CMOS/SOI器件[J].电子学报,1986(02):30-34.
Shen Zong-yong, Lin Cheng-lu, Zou Shi-chang. CMOS/SOI Devices Fabricated on Ar+ Laser Recrystallized Polysilicon Films[J]. Acta Electronica Sinica, 1986, (2): 30-34.
在Ar
+
激光再结晶多晶硅岛上制备出的CMOS/SOI器件
性能良好。N沟和P沟MOSFE7在沟道长度为4μm时
低场电子和空穴表面迁移串分别为510cm
2
/V.s和142cm
2
/V.s;CMOS六倒相器有好的静态和瞬态特性;CMOS九级环形振荡器P沟负载管和N沟输入管的W/L分别为112μm/6μm和52μm/6μm
其最小传输延时为2.8ns/级
最小延迟功耗乘积为2.6pJ/级。速度性能优于同尺寸的体硅CMOS器件。
CMOS/SOI devices are fabricated on Ar+ laser recrystallized polysilicon islands on SiO2 isolating layers. Both N-channel and P-channel MOSFET exhibit good output characteristics. The low field electron and hole mobilities of MOSFET with a channel length of 4 μm are 510cm2/V.s and 142cm2/V.s respectively. 6-stage CMOS inverters have fine static and transient characteristics. 9-stage CMOS ring oscillators with P-channel transistors of (W/L) = (112μm/6μm) and N-channel transistors of (W/L) = (52μm/6μm) are fabricated. The minimum propagation delay is 2.8ns/stage
and the minimum power delay product is 2.6pJ/stage. These speed performance of CMOS/SOI devices are superior to those of the same CMOS devices fabricated on bulk silicon.
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