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中国科学院半导体研究所
Published:1984
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[1]刘济民,郭增权,李大虹.无显影光刻机理的探讨[J].电子学报,1984(02):63-69.
Liu Ji-min, Guo Zeng-quan, Lin Da-hong. Investigation of Mechanism of Latent-Image Photoetching[J]. Acta Electronica Sinica, 1984, (2): 63-69.
本文研究了无显影光刻的机理
得出的结论是:氢氟酸与SiO
2
反应生成气态SiF
4
是无显影光刻实现的基础
凝胶的半透膜物化作用是促进氢氟酸腐蚀作用的媒介;光敏物质经光化学反应形成或改变其共振结构
是导致氢氟酸腐蚀效率改变的关键。
The mechanism of latent-image photoetching is investigated. The conclusion is that the reaction of fluorhydric acid and silicon dioxide is the base of latent-image etching. The semipermeable membrane of gel film promotes the etching. Under photochemical reaction the photosensitizer becomes the resonance system which affects the etching rate.
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