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Published:1979
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[1]张光华,,,,,,,,,,,林炳春,,,,,,,,,,,李金荣.离子注入双极硅ECL集成电路[J].电子学报,1979(04):99-103.
张光华, 林炳春, 李金荣. ION IMPLANTED BIPOLAR ECL SILICON IC[J]. Acta Electronica Sinica, 1979, (4): 99-103.
本文简要叙述用离子注入法制造双极硅ECL集成电路的实验结果。电阻器和晶体管基区的掺杂由注入硼来实现
发射区的掺杂则靠注入磷来完成。样品电路的门平均延时的典型值为2ns。文中着重介绍了注入离子能量、剂量、退火温度及时间对电路元件电学性能的影响。
The experimental results on fabricating the bipolar ECL silicon IC by ion implantation are reported. The resistor and transistor base doping has been accomplished by implanted boron
while the emitter doping by implanted phosphorus. The average delay time per gate of the sample circuit is typically 2 ns.Tbe present paper is devoted to describe the effect of the implanted energy
dose
and annealing temperature and time on electrical characteristics of circuit components.
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