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1. 合肥工业大学电子科学与应用物理学院,安徽,合肥,230601
2. 安徽工程大学电气工程学院,安徽,芜湖,241000
3. 合肥工业大学数学学院,安徽,合肥,230009
4. 合肥工业大学电子科学与应用物理学院,安徽,合肥,230601
5. 安徽工程大学电气工程学院,安徽,芜湖,241000
6. 合肥工业大学数学学院,安徽,合肥,230009
Published:2021
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ZUO Xiao-han, LIANG Hua-guo, NI Tian-ming, et al. A TSV Redundancy Architecture for Clustered Faults Based on Interval Grouping[J]. Acta Electronica Sinica, 2021, 49(4): 805-811.
ZUO Xiao-han, LIANG Hua-guo, NI Tian-ming, et al. A TSV Redundancy Architecture for Clustered Faults Based on Interval Grouping[J]. Acta Electronica Sinica, 2021, 49(4): 805-811. DOI: 10.12263/DZXB.20190957.
由于不成熟的工艺技术和老化影响,基于硅通孔(Through Silicon Via,TSV)的三维集成电路(Three-Dimensional Integrated Circuit,3D IC)中易发生聚簇故障,而降低芯片良率.为修复TSV聚簇故障,本文提出基于间隔分组的故障冗余结构.通过间隔分组将聚簇的TSV故障分散到不同冗余组从而利用各组的冗余资源修复,并利用MUX链实现组间共享冗余资源.实验结果表明,相较传统的路由、环形、切换转移冗余结构,本文结构修复率分别提高27.5%、62.7%及11.4%.并且在聚簇严重的情况下,本文结构修复率保持接近100%.
The yield of the Through-Silicon-Vias (TSVs)-based Three-Dimensional Integrated Circuits (3D ICs) is limited by the clustered faults due to immature manufacturing processes and aging. To tolerate TSV clustered faults
a redundancy architecture based on grouping at intervals is demonstrated in this paper. Owing to the use of grouping at intervals
the clustered TSV faults can be dispersed into different redundant groups and repaired with their own repair sources. Besides
MUX chains are utilized to realize the sharing of all repair sources. In experiments
compared with the previous router-based
ring-based and shift-switch redundancy architecture
the repair rates of proposed architecture are enhanced to 27.5%
62.7% and 11.4%
respectively. More importantly
the repair rate remains close to 100% in severely clustered situation.
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