LIU Jun,YU Wei-hua,LÜ Xin.The Study and Application of Terahertz Waveguide Package[J].ACTA ELECTRONICA SINICA,2022,50(08):1859-1865. DOI: 10.12263/DZXB.20210305.
The Study and Application of Terahertz Waveguide Package
Research on terahertz waveguide packaging technology and design verification in D-band (110~170GHz) and 220GHz band
respectively. Based on the wire bonding method
D-band LNA module is developed with self-designed amplifier chip. The module measurement shows the peak gain is 10.8dB at 139GHz,the gain higher than 7.8dB from 137GHz to 144GHz
the measured input return loss and output return loss are better than 5 dB and 8.5dB in operating frequencies
respectively. The tendency of packaged curve is same as the on-chip measured and its value is worse than the on-chip measurement about 5dB. A waveguide-to-integrated probe transition structure for terahertz band is proposed and verified in 220GHz. The module measurement shows the return loss is better than 8dB and the insertion loss is better than 3dB during 208GHz to 233GHz and the best performance is achieved at 224GHz with insertion loss is 1.3dB and return loss is 46.4dB. The waveguide-to-integrated probe transition structure provides experience for development of fully integrated terahertz chip.
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