Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration

YANG Xue-xia; SUN Qin-run; WANG Chao; PENG Yin-fei; ZHANG Wei-wei

doi:10.12263/DZXB.20220390

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Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration

PAPERS | 更新时间：2025-12-08

- Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration
- ACTA ELECTRONICA SINICA Vol. 51, Issue 10, Pages: 2783-2790(2023)
- 作者机构：
  
  1.太原科技大学应用科学学院，山西太原 030024
  2.东莞理工学院机械工程学院，广东东莞 523000
- 作者简介：
- 基金信息：
  
  National Natural Science Foundation of China(11602157);Shanxi Provincial Natural Science Foundation(20210302123220);Supported Project by the Key Laboratory of Robotics and Intelligent Equipment in Guangdong Province's Ordinary Universities(2017KSYS009);Supported by the Robot and Intelligent Equipment Innovation Center of Dongguan Institute of Technology(KCYCXPT2017006)
- DOI：10.12263/DZXB.20220390
  CLC： TN4;TG404
- Received：12 April 2022，
  
  Revised：2022-08-08，
  
  Published：25 October 2023
- 稿件说明：
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杨雪霞,孙勤润,王超等.基于随机振动过程应力分析的BGA焊点结构优化[J].电子学报,2023,51(10):2783-2790.

YANG Xue-xia,SUN Qin-run,WANG Chao,et al.Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration[J].ACTA ELECTRONICA SINICA,2023,51(10):2783-2790.
杨雪霞,孙勤润,王超等.基于随机振动过程应力分析的BGA焊点结构优化[J].电子学报,2023,51(10):2783-2790. DOI： 10.12263/DZXB.20220390.

YANG Xue-xia,SUN Qin-run,WANG Chao,et al.Optimization of BGA Solder Joint Structure Based on Stress Analysis of Random Vibration[J].ACTA ELECTRONICA SINICA,2023,51(10):2783-2790. DOI： 10.12263/DZXB.20220390.

摘要

建立了板级BGA（Ball Grid Array）焊点有限元分析模型，选取芯片高度、焊点直径、焊点高度、焊点间距作为设计变量，以焊点应力作为响应目标，分别采用田口正交及曲面响应法设计了25组不同水平组合的焊点模型并进行仿真计算，通过数理统计分析及回归分析对焊点结构参数进行了优化，获得了焊点应力最小结构参数最优水平组合.结果表明：在相同条件下，曲面响应优化的结果优于田口正交的结果；应力最小的焊点水平组合为焊点直径0.32 mm，焊点高度0.20 mm，焊点间距0.36 mm；最优水平组合等效应力值为0.3915 MPa，降低了0.65 MPa，实现了BGA焊点结构参数的优化.

Abstract

A board-level BGA (Ball Grid Array) solder joint finite element model is established. The chip height

solder joint diameter

solder joint height

and solder joint spacing are selected as design variables

and the critical solder joint stress is used as the response target. We design 25 groups of solder joint models simulating and calculating based on the Taguchi orthogonal and the surface response method The structural parameters of the solder joints are optimized through mathematical statistical and regression analysis. And the optimal solder structural combination with the minimum joint stress is obtained. The results show that the result of surface response optimization is better than the Taguchi orthogonal under the same conditions. And the best combination of solder joints is solder joint diameter 0.32 mm

solder joint height 0.20 mm

solder joint spacing 0.36 mm. The equivalent stress value of the best combination is 0.391 5 MPa

which is reduced by 0.65 MPa. They show that the optimization of the structural parameters of BGA solder joints is achieved.

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references

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