Multi-Physics Coupling Simulation Method of Package-Circuit Based on Harmonic Analysis

WANG Wei-jie; LIU Yan-nan; ZHAO Zhen-guo

doi:10.12263/DZXB.20230501

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Multi-Physics Coupling Simulation Method of Package-Circuit Based on Harmonic Analysis

PAPERS | 更新时间：2025-12-08

- Multi-Physics Coupling Simulation Method of Package-Circuit Based on Harmonic Analysis
- ACTA ELECTRONICA SINICA Vol. 52, Issue 8, Pages: 2718-2725(2024)
- 作者机构：
  
  1.中物院高性能数值模拟软件中心，北京 100088
  2.北京应用物理与计算数学研究所，北京 100088
- 作者简介：
- 基金信息：
  
  National Natural Science Foundation of China(12001053)
- DOI：10.12263/DZXB.20230501
  CLC： TP319;
- Received：05 June 2023，
  
  Revised：2024-01-29，
  
  Published：25 August 2024
- 稿件说明：
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王卫杰, 刘燕婻, 赵振国. 基于谐波分析的封装-电路多物理场耦合仿真方法[J]. 电子学报, 2024, 52(08): 2718-2725.

WANG Wei-jie, LIU Yan-nan, ZHAO Zhen-guo. Multi-Physics Coupling Simulation Method of Package-Circuit Based on Harmonic Analysis[J]. Acta Electronica Sinica, 2024, 52(08): 2718-2725.
王卫杰, 刘燕婻, 赵振国. 基于谐波分析的封装-电路多物理场耦合仿真方法[J]. 电子学报, 2024, 52(08): 2718-2725. DOI：10.12263/DZXB.20230501

WANG Wei-jie, LIU Yan-nan, ZHAO Zhen-guo. Multi-Physics Coupling Simulation Method of Package-Circuit Based on Harmonic Analysis[J]. Acta Electronica Sinica, 2024, 52(08): 2718-2725. DOI：10.12263/DZXB.20230501

摘要

场-路耦合仿真可以支持跨越芯片-封装-系统的多层级协同分析，多物理场仿真能够对多物理约束下芯片封装的信号完整性、电源完整性以及可靠性进行提前设计.因此，针对场-路结构的多物理场耦合仿真能够实现在初期对芯片封装的设计方案进行筛选和优化，是先进封装仿真技术最重要的发展方向之一.本文基于场-路耦合仿真和多物理场耦合仿真方法的最新研究进展，提出针对非线性场-路结构的频域仿真方法以及电磁-热耦合计算方法.该方法能够解决基于时域仿真方法的场-路耦合仿真的长时间迭代问题，实现多物理约束下非线性场-路结构的电磁与热特性快速分析.计算结果验证了本文方法的准确性和高效性.

Abstract

Field-circuit coupling simulation methods can achieve multi-level collaborative analysis across chips

packages

and systems. Multi-physics simulation methods can be used to design the signal integrity

power integrity

and reliability of chip packaging under multiple physical constraints. The combination of field-circuit coupling simulation and multi-physics simulation has become a crucial direction for advanced packaging simulation technology. By utilizing these two types of simulations together

early-stage optimization of chip packaging designs can be achieved. This article discusses the current research status of field-circuit coupling simulation and multi-physics coupling simulation. The article also proposes a frequency-domain method for non-linear field-circuit co-simulation and an electromagnetic-thermal coupling simulation method. The frequency-domain method avoids the long iterative process of field-circuit coupling simulation based on time-domain methods

solving the multi-physics electromagnetic-thermal coupling analysis problem of non-linear field-circuit under multi-physics constraints. The calculation results verify the accuracy and efficiency of the proposed method

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Keywords

references

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