Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole

PENG Bo; WANG Ming-yang; GAN Zuo-teng; LIU Lin-jie; DU Ping-an

doi:10.12263/DZXB.20230998

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Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole

PAPERS | 更新时间：2025-12-11

- Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole
- ACTA ELECTRONICA SINICA Vol. 52, Issue 11, Pages: 3899-3906(2024)
- 作者机构：
  
  1.电子科技大学，四川成都 610054
  2.中国电子科技集团有限公司第十三研究所，河北石家庄 050051
- 作者简介：
- 基金信息：
  
  National Natural Science Foundation of China(52175218)
- DOI：10.12263/DZXB.20230998
  CLC： TN305.94;
- Received：24 October 2023，
  
  Revised：2024-04-29，
  
  Published：25 November 2024
- 稿件说明：
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彭博, 王明阳, 淦作腾, 等. 考虑布线-通孔的陶瓷封装基板嵌入式微流道设计[J]. 电子学报, 2024, 52(11): 3899-3906.

PENG Bo, WANG Ming-yang, GAN Zuo-teng, et al. Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole[J]. Acta Electronica Sinica, 2024, 52(11): 3899-3906.
彭博, 王明阳, 淦作腾, 等. 考虑布线-通孔的陶瓷封装基板嵌入式微流道设计[J]. 电子学报, 2024, 52(11): 3899-3906. DOI：10.12263/DZXB.20230998

PENG Bo, WANG Ming-yang, GAN Zuo-teng, et al. Design of Embedded Microchannels for Ceramic Packaging Substrate Considering Wiring and Though Hole[J]. Acta Electronica Sinica, 2024, 52(11): 3899-3906. DOI：10.12263/DZXB.20230998

摘要

芯片热流密度持续增加对封装散热提出了新的挑战，液冷微流道散热技术是解决封装热控制问题的重要研究方向.针对陶瓷封装高功耗芯片散热需求，本文提出在陶瓷基板上嵌入微流道，以缩短芯片与热沉距离，降低热阻，同时减小热控系统体积，实现热控、电气互连与结构的集成.嵌入式微流道结构设计的关键是如何考虑基板上的密集布线和通孔，避免布线、通孔和微流道的相互干涉.考虑布线和通孔的微流道结构，提出了微流道-布线-通孔的陶瓷基板一体化工艺方法.测试结果表明，微流道层位置的影响大于结构参数影响，微流道入口主流道汇流层与散热层应设计在同一结构层.设计的微流道陶瓷基板满足功耗100 W的芯片散热要求.

Abstract

As the heat flux of the chip continues to increase

the heat dissipation of package is a new challenge. Liquid cooling micro-channel heat dissipation technology is an important research direction to solve the problem of packaging thermal management. In this paper

microchannels embedded in ceramic substrate is proposed to solve the heat dissipation requirement of high power chip. This structure can shorten the distance between chip and heat sink

and reduce thermal resistance. It can also reduce the volume of the thermal control system

and realize the thermal control

electrical interconnection and the integration of the structure. The design of embedded microchannels structure needs to consider the dense wiring and though hole in the ceramic substrate to avoid the interference between them. An embedded microchannels structure considering wiring and though hole is designed

and an integrated processing method of micro-channel-wiring-via is proposed in this paper. The test results show that the location of embedded microchannels is more important than the structural parameters. The convergence layer and the heat dissipation layer of the main channel of the embedded microchannels should be designed in the same layer. This embedded microchannels for ceramic packaging substrate can meet the heat dissipation requirement of the 100 W chip.

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references

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