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1.湖南师范大学物理与电子科学学院,湖南长沙 410081
2.后摩尔时代物理与器件湖南省普通高等学校重点实验室,湖南长沙 410081
Received:14 November 2024,
Accepted:27 January 2026,
Published:25 February 2026
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周颖, 刘小年, 刘焱森, 等. 基于TCAD与DNN的FinFET器件辐射总剂量效应模型[J]. 电子学报, 2026, 54(02): 634-645.
ZHOU Ying, LIU Xiaonian, LIU Yansen, et al. A TCAD-DNN-Based Total-Ionizing-Dose Effect Model for FinFET Devices[J]. Acta Electronica Sinica, 2026, 54(02): 634-645.
周颖, 刘小年, 刘焱森, 等. 基于TCAD与DNN的FinFET器件辐射总剂量效应模型[J]. 电子学报, 2026, 54(02): 634-645. DOI:10.12263/DZXB.20241033
ZHOU Ying, LIU Xiaonian, LIU Yansen, et al. A TCAD-DNN-Based Total-Ionizing-Dose Effect Model for FinFET Devices[J]. Acta Electronica Sinica, 2026, 54(02): 634-645. DOI:10.12263/DZXB.20241033
先进鳍式场效应晶体管(Fin Field-Effect Transistor,FinFET)因其高集成度、强栅极控制能力、高驱动电流、高开关速度、低泄漏电流等优势,在先进集成电路中成为主要的晶体管器件。为得到器件物理层面的FinFET工艺下不同器件尺寸的辐射总剂量(Total-Ionizing-Dose,TID)效应模型,本文结合TCAD(Technology Computer Aided Design)技术与深度神经网络(Deep Neural Networks,DNN)技术提出并建立了一个辐射总剂量效应模型(TCAD-DNN模型)来预测器件的TID效应的电学响应。本文采用Synopsys Sentaurus TCAD软件对SMIC 14 nm CMOS工艺下的FinFET进行三维(3D)器件建模并进行实测数据校准,后利用Sentaurus软件内置的Gamma射线总剂量辐射模型对器件进行辐射总剂量效应模拟仿真,相比于添加固定电荷以模拟总剂量辐射效应的做法,Gamma射线总剂量辐射模型可以得到更为真实的总剂量效应陷阱电荷分布。通过对器件在辐照前后进行实际电学特性测试,将得到的辐照前后实测数据用于TCAD模型校准,对此工艺节点下不同器件尺寸进行仿真产生数据集,其中32 928个器件数据点作为训练集对该模型进行训练,另外8 232个器件数据点作为测试集,对FinFET器件在开态(ON)辐照偏置下的总剂量效应进行预测。训练后的最终模型所得曲线与测试集数据的平均相对误差为2.98‰。此外,模型所得预测曲线与辐照后的实测数据也有极佳的吻合度,进一步验证了模型在实际工程应用中的巨大潜力。本文结合TCAD仿真技术和深度学习技术构建的TCAD-DNN模型仅需提供特定尺寸范围内的若干器件尺寸的电学特性曲线作为训练集对TCAD-DNN模型进行训练,训练完成后的模型能够在毫秒量级的调用时间内得到一定尺寸和总剂量范围内所有器件可靠的电学性能。此模型有效避免了TCAD仿真中的耗时过长和收敛性不稳定问题,成功预测了器件总剂量效应的电学响应对辐射剂量和器件几何参数方面的依赖性,该模型较高的预测精度和较好的灵活性使其能够应用在FinFET器件设计优化和器件与集成电路抗辐射加固等领域。
The fin field-effect transistor (FinFET) has become the primary transistor device in advanced integrated circuits due to its advantages such as high integration
strong gate control capability
high drive current
high switching speed
and low leakage current. To obtain a physical-level total-ionizing-dose (TID) effect model for different device sizes under FinFET technology in advanced integrated circuits
this paper proposes and establishes a technology computer aided design-deep neural networks (TCAD-DNN) model to predict the electrical response of TID effects in devices. This paper uses Synopsys Sentaurus TCAD software to perform three-dimensional (3D) device modeling and actual measurement data calibration for FinFETs in the SMIC 14 nm CMOS process. Subsequently
the built-in Gamma-ray total dose irradiation model in Sentaurus software is utilized to simulate the total dose irradiation effects of the devices. Compared to the method of adding fixed charges to simulate total dose irradiation effects
the Gamma-ray total dose radiation model can obtain a more realistic distribution of trap charges due to total dose effects. By conducting actual electrical characteristic tests on the devices before and after irradiation
the obtained measured data before and after irradiation are used for TCAD model calibration. Simulations are performed on different device sizes under this process node to generate a dataset
where 32 928 device data points serve as the training set to train the model
and another 8 232 device data points serve as the test set to predict the total dose effects of FinFET devices under ON-state irradiation bias. The average relative error between the final model curve obtained after training and the test set data is 2.98‰. Furthermore
the predicted curve obtained from the model also has excellent agreement with the measured data after irradiation
which further verifies the great potential of the model in practical engineering applications. The TCAD-DNN model constructed in this paper
combining TCAD simulation technology and deep learning technology
only requires the provision of electrical characteristic curves for a certain range of device sizes as the training set for training the TCAD-DNN model. The trained model can obtain reliable electrical performance for all devices within a certain size and total dose range within a millisecond-scale call time. This model effectively avoids the issues of excessive simulation time and unstable convergence in TCAD simulations
successfully predicting the dependence of the electrical response of total dose effects on radiation dose and device geometric parameters. The high prediction accuracy and good flexibility of this model make it applicable in fields such as FinFET device design optimization and radiation hardening of devices and integrated circuits.
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