Highly Integrated Three-Dimensional Structure Ultra-Wideband LTCC Power Divider

JIANG Jun-yi; WANG Zi-cheng; SHI Gang; HU Shan-wen

doi:10.12263/DZXB.20250091

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Highly Integrated Three-Dimensional Structure Ultra-Wideband LTCC Power Divider

PAPERS | 更新时间：2025-10-16

- Highly Integrated Three-Dimensional Structure Ultra-Wideband LTCC Power Divider
- ACTA ELECTRONICA SINICA Vol. 53, Issue 6, Pages: 1917-1922(2025)
- 作者机构：
  
  南京邮电大学电子与光学工程学院、柔性电子（未来技术）学院，江苏南京 210023
- 作者简介：
- 基金信息：
  
  National Natural Science Foundation of China(61501261);Research Fund of Jiangsu Provincial National and Local Joint Engineering Laboratory of Radio Frequency Integration and Microassembly Technology(KFJJ20200101);Jiangsu Provincial Frontier Technology Research and Development Program(BF2024080)
- DOI：10.12263/DZXB.20250091
  CLC： TN626;
- Received：30 January 2025，
  
  Revised：2025-05-21，
  
  Published：25 June 2025
- 稿件说明：
移动端阅览
蒋俊毅, 王梓丞, 施刚, 等. 三维高集成度超宽带LTCC功分器[J]. 电子学报, 2025, 53(06): 1917-1922.

JIANG Jun-yi, WANG Zi-cheng, SHI Gang, et al. Highly Integrated Three-Dimensional Structure Ultra-Wideband LTCC Power Divider[J]. Acta Electronica Sinica, 2025, 53(06): 1917-1922.
蒋俊毅, 王梓丞, 施刚, 等. 三维高集成度超宽带LTCC功分器[J]. 电子学报, 2025, 53(06): 1917-1922. DOI：10.12263/DZXB.20250091

JIANG Jun-yi, WANG Zi-cheng, SHI Gang, et al. Highly Integrated Three-Dimensional Structure Ultra-Wideband LTCC Power Divider[J]. Acta Electronica Sinica, 2025, 53(06): 1917-1922. DOI：10.12263/DZXB.20250091

摘要

本文基于低温共烧陶瓷（Low Temperature Co-fired Ceramic，LTCC）三维封装技术，通过将多节四分之一波长阻抗变换线进行折叠布局和垂直堆叠设计，实现了多节宽带功分器的高度集成.本设计将7节阻抗变换线分别放置在LTCC介质的奇数层上，相邻阻抗变换线之间采用垂直过孔进行连接，偶数层用来隔离阻抗变换线之间的耦合效应.该功分器不仅实现了180%的相对带宽，而且尺寸仅为4 mm × 4 mm × 1.33 mm.相比同样传输节数平面型功分器，本设计的水平尺寸减小了84.6%.在2~38 GHz的频率范围内，

、

和

的实测值分别优于

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605741&type=

2.28600001

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605756&type=

4.99533367

、

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605743&type=

2.28600001

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605744&type=

5.75733376

、

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605745&type=

2.28600001

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605746&type=

4.99533367

、

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605761&type=

2.28600001

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605772&type=

5.75733376

和

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605793&type=

2.28600001

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605774&type=

4.99533367

dB.该功分器同时具有超宽带特性和小型化、高度集成的优势，可广泛应用于移动通信、雷达探测、卫星导航、工业测量等领域中.

Abstract

Based on the low temperature co-fired ceramic (LTCC) three-dimensional packaging technology

this paper folds and vertically stacks multiple quarter-wavelength impedance transformation lines to achieve high integration in a multi-section broadband power divider. This design places 7 impedance transformation lines on the odd layers of the LTCC medium

and vertical vias are used to connect adjacent impedance transformation lines. Even layers are used to isolate the coupling effect between impedance transformation lines. The power divider not only achieves a relative bandwidth of 180%

but also has a size of only 4 mm ×

4 mm × 1.33 mm. Comparing with the planar power divider with the same number of transmission sections

the horizontal size of this design is reduced by 84.6%. In the frequency range of 2~38 GHz

the measured values of

and

are better than

</mo><mtext> </mtext><mo>-</mo><mn mathvariant="normal">4.1</mn><mo>

</mo><mtext> </mtext><mo>-</mo><mn mathvariant="normal">16</mn><mo>

</mo><mtext> </mtext><mo>-</mo><mn mathvariant="normal">4.0</mn><mtext> </mtext><mi mathvariant="normal">a</mi><mi mathvariant="normal">n</mi><mi mathvariant="normal">d</mi><mtext> </mtext><mo>-</mo><mn mathvariant="normal">17</mn><mtext> </mtext><mi mathvariant="normal">d</mi><mi mathvariant="normal">B</mi></math>

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605775&type=

2.70933342

https://html.publish.founderss.cn/rc-pub/api/common/picture?pictureId=91605776&type=

42.58732986

respectively. Since the power divider has the advantages of ultra-wideband characteristics

miniaturization and high integration

it can be widely used in mobile communications

radar detection

satellite navigation

industrial measurement and other fields.

关键词

Keywords

references

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SONG K J , ZOU X J , ZHOU Y D , et al . Miniaturized ultrawideband reconfigurable power divider based on slotline and double-sided parallel-strip line [J ] . IEEE Transactions on Microwave Theory and Techniques , 2021 , 69 ( 4 ): 2130 - 2137 .

ZHANG Z W , ZHANG G , TAM K W , et al . Packaged wideband highly selective filtering power divider with arbitrary phase difference and power dividing ratio on multilayer stripline [J ] . IEEE Transactions on Microwave Theory and Techniques , 2024 , 72 ( 8 ): 4757 - 4769 .

GO D J , MIN B C , KIM M J , et al . Compact ultra-wideband Wilkinson power divider in parallel stripline with modified isolation branches [J ] . Sensors , 2024 , 24 ( 11 ): 3437 .

KASAR Ö . Theoretical design and implementation of equal and unequal split ultra-wide band Wilkinson power divider with Chebyshev impedance transform [J ] . Journal of Electrical Engineering , 2024 , 75 ( 5 ): 383 - 391 .

卢启军 , 韩大伟 , 张浩 , 等 . 基于阻抗补偿技术的毫米波超宽带功分器 [J ] . 电子学报 , 2025 , 53 ( 1 ): 112 - 118 .

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杨亚洋 , 吕超杰 , 林宏声 . 0.1～3 GHz超宽带小型化LTCC功分器研究 [J ] . 微波学报 , 2024 , 40 ( S1 ): 151 - 154 .

YANG Y Y , LÜ C J , LIN H S . Research on a 0.1~3 GHz ultra-wideband miniaturized LTCC power divider [J ] . Journal of Microwaves , 2024 , 40 ( S1 ): 151 - 154 . (in chinese)

沈光煦 , 徐鹏涵 , 冯文杰 , 等 . 一种紧凑型毫米波IPD片上滤波功分器 [J ] . 微波学报 , 2023 , 1 : 1 - 6 .

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ZHAO W , WU Y L , YANG Y H , et al . Novel on-chip wideband filtering power dividers with high selectivity and ultra-wide out-of-band suppression in LTCC technology [J ] . IEEE Transactions on Circuits and Systems II: Express Briefs , 2022 , 69 ( 11 ): 4288 - 4292 .

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