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1.西安电子科技大学集成电路学部,陕西西安 710071
2.国防科技大学计算机学院,湖南长沙 410073
Received:21 August 2025,
Accepted:23 December 2025,
Published:25 December 2025
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皮辉斌, 吴龙胜, 文溢, 等. 亚20 nm FinFET工艺温度传感器低温总剂量效应研究[J]. 电子学报, 2025, 53(12): 4665-4670.
PI Hui-bin, WU Long-sheng, WEN Yi, et al. Total Ionizing Dose Effects at Cryogenic Temperatures on a Sub-20 nm FinFET Temperature Sensor[J]. Acta Electronica Sinica, 2025, 53(12): 4665-4670.
皮辉斌, 吴龙胜, 文溢, 等. 亚20 nm FinFET工艺温度传感器低温总剂量效应研究[J]. 电子学报, 2025, 53(12): 4665-4670. DOI:10.12263/DZXB.20250733
PI Hui-bin, WU Long-sheng, WEN Yi, et al. Total Ionizing Dose Effects at Cryogenic Temperatures on a Sub-20 nm FinFET Temperature Sensor[J]. Acta Electronica Sinica, 2025, 53(12): 4665-4670. DOI:10.12263/DZXB.20250733
本文针对深空探测等极端环境下太空任务对电子器件的需求,研究了亚20 nm体硅FinFET工艺下温度传感器的低温总剂量(Total Ionizing Dose,TID)效应.该温度传感器核心电路为基于PNP双极晶体管构成的带隙基准电路.理论分析表明,290 K与110 K辐照下双极晶体管退化均表现为基极复合电流增大,但其主导机制存在本质差异:常温下界面陷阱密度增加主导复合过程,符合氢离子漂移致Si-H键断裂的经典模型;而在极低温环境下,氢离子的漂移运动被“冻结”,边界陷阱隧穿辅助复合机制成为退化的主要原因.由于110 K时边界陷阱浓度远大于290 K时界面陷阱浓度,导致明显的低温辐照损伤增强效应.电路分析与仿真验证表明,随着辐射诱导泄漏电流从0 nA增加至100 nA,带隙基准电压显著变化,导致输出温度码增加约21 bit,这从电路层面预言了辐照会导致温度码正向漂移.为验证理论分析,基于定制的低温总剂量效应测试系统,分别在110 K和290 K温度条件下,利用Co
60
γ射线源对测试芯片进行了累积1 Mrad(Si)总剂量辐照试验.实验结果表明,1 Mrad(Si)辐照后,110 K低温辐照下传感器的温度码累积增加值分别达到37 bit和30 bit,显著高于290 K室温辐照下的9 bit,明确验证了低温辐照损伤增强效应.本研究为极低温辐射环境下FinFET集成电路(特别是依赖双极器件的传感器)的设计与加固提供
了重要的理论依据和实验参考.
This paper investigates the cryogenic total ionizing dose (TID) effects on a temperature sensor fabricated in a sub-20 nm bulk silicon FinFET technology
targeting applications in extreme environments such as deep-space exploration. The sensor core utilizes a bandgap reference circuit based on PNP bipolar junction transistors. Theoretical analysis reveals that the degradation of bipolar transistors under irradiation at 290 K or 110 K manifests an increase in the base recombination current. However
the underlying dominant mechanisms are fundamentally different. At room temperature (290 K)
the degradation is primarily governed by an increase in the interface trap density
consistent with the classical model involving hydrogen ion (H⁺) drift leading to the breaking of Si-H bonds. In contrast
under cryogenic conditions (110 K)
the drift motion of H⁺ ions is effectively “frozen”
and the tunneling-assisted recombination mechanism via border traps becomes the main contributor to degradation. Given that the border trap concentration at 110 K is significantly higher than the interface trap concentration at 290 K
a pronounced enhancement of radiation damage at cryogenic temperatures is observed. Circuit analysis and simulation validation demonstrate that as the radiation-induced leakage current increases from 0 nA to 100 nA
the bandgap reference voltage undergoes significant changes
resulting in an approximate 21 bit increase in the output temperature code. This finding theoretically predicts a positive drift in the temperature code due to irradiation. To experimentally verify the theoretical analysis
irradiation tests were conducted using a customized cryogenic TID effect test system and a Co⁶⁰ γ-ray source
accumulating a total dose of 1 Mrad(Si) under 110 K and 290 K conditionsrespectively. The experimental results unequivocally show that after 1 Mrad(Si) irradiation
the cumulative increases in the temperature code for sensors irradiated at 110 K reach 37 bits and 30 bits
respectively
which are substantially greater than the 9 bit increase observed under 290 K room-temperature irradiation. This clear quantitative evidence firmly validates the existence of cryogenic temperature radiation damage enhancement effects. This study provides crucial theoretical insights and experimental data for the design and radiation hardening of FinFET integrated circuits
particularly sensors relying on bipolar devices
operating in extreme low-temperature and high-radiation environments.
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