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Study of Inter-Chip Wireless Connection with Mushroom-Type Metamaterial-Constructed Innovative PCB Channels
更新时间:2025-07-16
    • Study of Inter-Chip Wireless Connection with Mushroom-Type Metamaterial-Constructed Innovative PCB Channels

    • Acta Electronica Sinica   Vol. 43, Issue 12, Pages: 2455-2460(2015)
    • DOI:10.3969/j.issn.0372-2112.2015.12.016    

      CLC: TN43
    • Published:2015

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  • WANG Wen-song, CHEN Yin-chao, YANG Shu-hui, et al. Study of Inter-Chip Wireless Connection with Mushroom-Type Metamaterial-Constructed Innovative PCB Channels[J]. Acta Electronica Sinica, 2015, 43(12): 2455-2460. DOI: 10.3969/j.issn.0372-2112.2015.12.016.

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