An Investigation on the Melting Temperature and the Formation Enthalpy of Nanocrystallines Sn-Ag Solder Alloy

WU Min; LV Bai-lin

doi:10.3969/j.issn.0372-2112.2016.01.033

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An Investigation on the Melting Temperature and the Formation Enthalpy of Nanocrystallines Sn-Ag Solder Alloy

更新时间：2025-07-16

- An Investigation on the Melting Temperature and the Formation Enthalpy of Nanocrystallines Sn-Ag Solder Alloy
- Acta Electronica Sinica Vol. 44, Issue 1, Pages: 222-226(2016)
- 作者机构：
  
  辽宁石油化工大学机械学院,辽宁,抚顺,114001
- 作者简介：
- 基金信息：
  
  Research Project of Department of Education of Liaoning Province (No.2008382);Science Fund of LiaoNing Petrochemical University (No.xjj2013-005)
- DOI：10.3969/j.issn.0372-2112.2016.01.033
  CLC： TG42
- Published：2016
- 稿件说明：
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WU Min, LV Bai-lin. An Investigation on the Melting Temperature and the Formation Enthalpy of Nanocrystallines Sn-Ag Solder Alloy[J]. Acta Electronica Sinica, 2016, 44(1): 222-226.
DOI：

WU Min, LV Bai-lin. An Investigation on the Melting Temperature and the Formation Enthalpy of Nanocrystallines Sn-Ag Solder Alloy[J]. Acta Electronica Sinica, 2016, 44(1): 222-226. DOI： 10.3969/j.issn.0372-2112.2016.01.033.

摘要

考虑表面效应

基于Lindemann熔化准则

利用Miedema 模型对Sn-Ag纳米钎料合金的熔化温度及形成焓进行计算.Sn-Ag纳米合金微粒的熔化温度及形成焓均依赖于尺寸和组元成分;对于Sn3.5Ag纳米钎料合金

当微粒尺寸大小为5nm时

其熔化温度下降约为7%;而合金形成焓随晶粒粒径的减小而增加

合金稳定性降低;对于Sn3.5Ag钎料合金

当粒径尺寸为0.1m时

合金形成焓完全为正值

对Sn-Ag钎料合金组织形成存在产生很大影响.

Abstract

Considering the surface effect

the melting temperature and the formation enthalpy of Sn-Ag nanoscale solder alloy were calculated by Miedema model using Lindemann melting criterion.The results show that the melting temperature and the formation enthalpy of Sn-Ag nanoscale solder alloy are dependent on the grain size and component composition.When the particle size is 5nm

the melting temperature decreased by about 7% for Sn3.5Ag nanoscale solder alloy;while the formation enthalpy of the alloy increases with the decrease of particle size

and the alloy stability decreases accordingly.Meanwhile

the formation enthalpy of the Sn3.5Ag solder alloy is completely positive when the grain size is 0.1 m

which can create significant influence on the microstructure formation of the Sn-Ag solder alloy.

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