Fault-Tolerant Method of Critical Communication Components in 3D NoC: A Review

OUYANG Yi-ming; SUN Cheng-long; CHEN Qi; LIANG Hua-guo; YI Mao-xiang; HUANG Zheng-feng; YAN Ai-bin

doi:10.3969/j.issn.0372-2112.2016.12.034

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Fault-Tolerant Method of Critical Communication Components in 3D NoC: A Review

更新时间：2025-07-16

- Fault-Tolerant Method of Critical Communication Components in 3D NoC: A Review
- Acta Electronica Sinica Vol. 44, Issue 12, Pages: 3053-3063(2016)
- 作者机构：
  
  1. 合肥工业大学计算机与信息学院,安徽,合肥,230009
  2. 合肥工业大学电子科学与应用物理学院,安徽,合肥,230009
- 作者简介：
- 基金信息：
  
  National Natural Science Foundation of China (No.61474036, No.61274036, No.61371025, No.61574052);Natural Science Foundation of Anhui Province (No.1508085MF117)
- DOI：10.3969/j.issn.0372-2112.2016.12.034
  CLC： TP302
- Published：2016
- 稿件说明：
移动端阅览
OUYANG Yi-ming, SUN Cheng-long, CHEN Qi, et al. Fault-Tolerant Method of Critical Communication Components in 3D NoC: A Review[J]. Acta Electronica Sinica, 2016, 44(12): 3053-3063.
DOI：

OUYANG Yi-ming, SUN Cheng-long, CHEN Qi, et al. Fault-Tolerant Method of Critical Communication Components in 3D NoC: A Review[J]. Acta Electronica Sinica, 2016, 44(12): 3053-3063. DOI： 10.3969/j.issn.0372-2112.2016.12.034.

摘要

三维片上网络通过硅通孔（Through Silicon Via，TSV）将多层芯片进行堆叠，具有集成密度大，通信效率高等特点，是片上多核系统的主流通信架构.然而，工艺偏差及物理缺陷所引发的错误和TSV良率较低等因素，使得三维片上网络面临严重的故障问题.为保证通信效率，对三维片上网络关键通信部件进行容错设计必不可少.本文针对三维片上网络关键通信部件路由器和TSV的故障和容错相关问题，从容错必要性、国内外研究现状、未来的研究方向和关键问题、以及拟提出的相关解决方案四个方面，展开深入探讨.为提高片上网络可靠性、保证系统高效通信提供一体化的解决方案.

Abstract

3D NoC stacking the multi-chips with TSV has many advantages

such as high integration density and high communication efficiency.It is the mainstream of communication architecture on multi-core on-chip systems.However

due to the process variation

physical defects and low yield of TSV

3D NoC is facing serious fault problems.It is essential to design a fault-tolerant mechanism for 3D NoC to ensure the efficiency of communication.In this paper

we focus on the failure and fault-tolerance issues of the critical communication components (routers and TSVs) in 3D NoC.From the description of fault-tolerance necessity

researches situation at home and abroad

future research directions

key issues and the proposed solutions

we conduct an in-depth discussion.Thus

we provide integrated solutions for improving the reliability of NoC and ensuring efficient communication system.

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