Nowadays

due to the lack of appropriate 3D SICs (3D Stacked Integrated Circuits) cost estimation methods under the impact of the multiple bonding

and the generally neglect of the discarding costs in test process production

the existing test methods can not be well applied in the actual production.Based on the feature of mid-bond test

this paper proposed a 3D SICs theoretical total cost model

by synergistically considering the bonding rate and discarding cost

further

a 3D SICs optimal bonding order algorithm is proposed.Finally

the paper also puts forward a method to optimize the mid-bonding test times.This method can achieve multiple bondings but plus one test by replacing the traditional one bonding and plus one test method.Experimental results show that the cost of the proposed model is closer to the actual production.Optimal bonding order and Optimized mid-bonding test times can be effective to guide the 3D chip manufacturing.