Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process

TANG Xiang-qiong; HUANG Chun-yue; LIANG Ying; KUANG Bing; ZHAO Sheng-jun

doi:10.3969/j.issn.0372-2112.2020.06.011

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Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process

更新时间：2025-07-16

- Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process
- Acta Electronica Sinica Vol. 48, Issue 6, Pages: 1117-1123(2020)
- 作者机构：
  
  1. 桂林电子科技大学机电工程学院,广西,桂林,541004
  2. 成都航空职业技术学院信息工程学院,四川,成都,610021
  3. 桂林电子科技大学机电工程学院,广西,桂林,541004
  4. 成都航空职业技术学院信息工程学院,四川,成都,610021
- 作者简介：
- 基金信息：
- DOI：10.3969/j.issn.0372-2112.2020.06.011
  CLC： TG404
- Published Online：25 June 2020，
  
  Published：2020
- 稿件说明：
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TANG Xiang-qiong, HUANG Chun-yue, LIANG Ying, et al. Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process[J]. Acta Electronica Sinica, 2020, 48(6): 1117-1123.
DOI：

TANG Xiang-qiong, HUANG Chun-yue, LIANG Ying, et al. Parameter Optimization of the Board Level Assembly BGA Solder Joints Based on Stress Analysis of Reflow Cooling Process[J]. Acta Electronica Sinica, 2020, 48(6): 1117-1123. DOI： 10.3969/j.issn.0372-2112.2020.06.011.

摘要

建立了板级组件BGA（Ball Grid Array）焊点有限元分析模型，对BGA焊点进行了再流焊冷却过程应力仿真分析，设计并完成了验证性实验以验证仿真分析方法的有效性，分析了焊点结构参数和材料变化对焊点再流焊冷却过程应力应变的影响，采用响应面法建立了焊点应力与结构参数的回归方程，结合遗传算法对焊点结构参数进行了优化.结果表明：实验结果证明了仿真分析的有效性；焊点应力随着焊点高度的增加而增大，随着焊点直径的增加而减小；最优焊点结构参数水平组合为：焊点高度0.44mm、焊点直径0.65mm、焊盘直径0.52mm和焊点间距1.10mm；对该最优焊点仿真验证表明最大应力下降了0.1101MPa.

Abstract

A finite element model of board level assembly BGA (Ball Grid Array) solder joint is established

the stress simulation analysis of BGA solder joint in the cooling process of reflow soldering is carried out

the confirmatory experiment is designed and carried out to verify the validity of simulation analysis method

and the influence of solder joint structure parameters and material on the stress and strain of solder joint are analyzed. The regression equations of the stress and structure parameters of the solder joints is established by the response surface method

and solder joint structure parameters are optimized by genetic algorithm. The results show that the experiment results verify the effectiveness of the simulation analysis

the stress of the solder joint increases with the increase of the height of the solder joint

and decreases with the increase of the diameter of the solder joint

and the optimal level combination of solder joint structure parameters is the height of 0.44mm

the diameter of 0.65mm

the pad diameter of 0.52mm and the solder joint pitch of 1.10mm

the simulation results of the optimal level combination of solder joint show that the maximum stress decreases by 0.1101MPa.

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