National Natural Science Foundation of China (No.61571251);Ningbo Natural Science Fund (No.2018A610024);Key Subject of Ningbo Educational Science Plan (No.2019YZD004)
LI Jun, YIN Xi-lei, DAI Fa-liang, et al. The Research on Thermal Characteristics of RF Power Amplifier Based on ANSYS[J]. Acta Electronica Sinica, 2020, 48(12): 2487-2492.
DOI:
LI Jun, YIN Xi-lei, DAI Fa-liang, et al. The Research on Thermal Characteristics of RF Power Amplifier Based on ANSYS[J]. Acta Electronica Sinica, 2020, 48(12): 2487-2492. DOI: 10.3969/j.issn.0372-2112.2020.12.026.
The Research on Thermal Characteristics of RF Power Amplifier Based on ANSYS
a design and simulation of a RF power amplifier is presented. Then
the thermal characteristics analysis model of the RF power amplifier is built and the thermal characteristics of the RF power amplifier is analyzed by using the finite element method. After that the effects of increasing the through hole and different copper coating thickness
environmental temperature and dissipative power on the temperature
thermal stress and thermal deformation of the RF power amplifier are studied. Based on the above analysis
the RF power amplifier is fabricated and measured at last. In the frequency range of 3.3GHz to 3.6GHz
power added efficiency is from 62.6% to 69% with output power greater than 39.2dBm and gain larger than 12dB. When the ambient temperature is 21℃
the maximum temperature of the RF power amplifier reaches 90.0℃
and the test results are close to the simulation analysis results. The research of this paper provides important guidance for the design and manufacture of RF power amplifier in the future.