A model of microstrip bonding wire interconnects for millimeter wave applications is presented

which is based on neural network methods.The results from a FDTD full-wave algorithm have been used in the learning procedures of the neural network.The model can be applied to the design of millimeter wave integrated circuits.The scattering parameters of the bonding wire

which are related with the gap between microstrips

the height of bonding wires and the operating frequency

have been simulated by the neural network model.The scattering parameters of a bonding wire interconnect has been measured and compared with the results from the neural network model.