CAI Xing-jian, CAO Yi, MAO Jun-fa, et al. Simulation of Electrical Performance for High-Speed Dual-Coplanar PCB[J]. Acta Electronica Sinica, 2001, 29(2): 287-288.
CAI Xing-jian, CAO Yi, MAO Jun-fa, et al. Simulation of Electrical Performance for High-Speed Dual-Coplanar PCB[J]. Acta Electronica Sinica, 2001, 29(2): 287-288.DOI：
In order to accommodate to the irregular fabrication configuration
the 3D electromagnetic parameters extraction method of partial element equivalent circuit (PEEC) technology is used to model the cells of automatically partitioned ground/feeding plane with arbitrary shape.Then the response analysis in the time domain for the nonlinear circuit including I/O buffers is performed.The simulation result for a high-speed dual-coplanar PCB well fits the measured one
which indicates the validity of the proposed method.
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