With the development of the VLSI circuits

the feature size has been decreased to the deep sub-micron level

andworking frequency has reached to 2GHz. In order to assure the correctness of the IC design with high performance

the parasitic interconnect inductance and resistance should be calculated quickly and accurately.In this paper

we propose a description format to fit for 3-D hierarchical interconnect

an approach to automatically partitioning filaments in consideration of skin effect.An improved multipole accelerative computation based on the non-uniform cube subdivision is implemented.Numerical results show that it runs faster than the FastHenry

[1]

from several to several tens' times with comparable accuracy.