In this paper the four sets of standard processes developed by Institute of microelectronics of Peking University are presented.In these four sets of standard process

three of them are bulk micromachining processes and one is surface sacrificial process.The key technologies used in these processes were studied systematically.Research work included:systematically study how to control the stress of polysilicon film;developed two anti-stiction technologies;research of Si/Si bonding

Si/Ni/Si bonding and Si/Glass bonding;study and optimization of high aspect ratio silicon etching;successfully reducing RIE Lag from 23% to 5%;exploiting two kinds of multi-step silicon etching technologies.