Different from JEDEC standard test board

a round test board was introduced to do drop test and simulation.Lead-free solder joint reliability under board-level drop impact was investigated.Firstly

modal test was conducted in order to understand dynamic properties of test board.Secondly

strains and acceleration of test board were measured during drop test

and ABAQUS software was used to do drop simulation and model stresses and strains of solder joints under drop impact.Results show that the model established has close values of acceleration response and strain histories as measured in actual drop test

and the failure mode and critical solder ball location predicted by modeling correlate well with testing.The fracture occurs in intermetallic composite (IMC) on the package side.Failure mode is brittle fracture.