热致封装效应对MEMS器件谐振特性 影响的单元库模型

宋 竞; 黄庆安; 唐洁影

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热致封装效应对MEMS器件谐振特性影响的单元库模型

论文 | 更新时间：2025-07-16

- 热致封装效应对MEMS器件谐振特性影响的单元库模型
- Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device
- 电子学报 2008年36卷第5期页码：943-947
- 作者机构：
  
  东南大学MEMS教育部重点实验室,江苏,南京,210096
- 作者简介：
- 基金信息：
  
  国家863高技术研究发展计划 (No.2007AA04Z320);装备预先研究项目(315095109)
- DOI：
  中图分类号： TN402TN405
- 纸质出版：2008
- 稿件说明：
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宋竞, 黄庆安, 唐洁影. 热致封装效应对MEMS器件谐振特性影响的单元库模型[J]. 电子学报, 2008,36(5):943-947.

SONG Jing, HUANG Qing-an, TANG Jie-ying. Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device[J]. Acta Electronica Sinica, 2008, 36(5): 943-947.
宋竞, 黄庆安, 唐洁影. 热致封装效应对MEMS器件谐振特性影响的单元库模型[J]. 电子学报, 2008,36(5):943-947. DOI：

SONG Jing, HUANG Qing-an, TANG Jie-ying. Modeling of Thermally Induced Package Effect on the Resonant Characteristics of MEMS Device[J]. Acta Electronica Sinica, 2008, 36(5): 943-947. DOI：

摘要

大量试验和数值仿真结果均已确认封装-器件的热失配对MEMS器件性能及可靠性有显著影响

即热致封装效应.然而迄今为止仍缺乏有效的物理模型对此加以系统描述.本文基于单元库法思想和节点法分析手段构建了MEMS热致封装效应的理论模型.通过对非器件结构如锚区、衬底等标准化单元建模

扩充了节点分析法在封装级MEMS仿真领域的应用.文中以常见MEMS基本器件和封装结构为例进行了研究

计算了热致封装效应对器件谐振特性的影响

并利用有限元仿真进行验证.最后讨论了封装级MEMS设计面临的挑战.

Abstract

With the advance of the modeling of the device-level behaviors for the MEMS systems

characterizations for the package-level behaviors are becoming important.Results from either experimental or numerical studies have already validated the thermally-induced package effects on the performance and reliability of MEMS systems

while the theoretical descriptions for these effects are still lacked.In this paper

a theoretical joint model for the whole packaged MEMS system is established based on the Cell Library Concept and the Nodal Analysis Method to enable the package-level simulations for the designed devices.Cases of conventional package-device systems are studied to demonstrate the application of this joint model

and the results agree well with the FEM calculations.The challenges for the design of package-level MEMS systems are finally discussed.

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